Monroeville, PA   |   Murrysville, PA(412) 373-8110

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With 20 years of experience, Compunetics is a pioneer in very high density circuitry. It is one of only a few PCB manufacturers in the world to make these versatile boards for specialized applications and unusual physical constraints. Compunetics has become the vendor of choice when requirements include very high density interconnects.

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One interesting aspect of multilayer flex boards is the ability to have different cross-sections in different areas of the board. Let’s say you need 6 layers in one section but then have to “slim down” […]

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A multitude of things can be added to a “simple” single or double sided flex to enhance form, fit and function. Mechanical stiffeners bonded to one or both sides can be designed to match virtually […]

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Flying leads are one of the unique benefits that can be used on single and double sided flex board designs. The circuit traces become the interconnect to the next board, no connectors required. Just unsupported […]

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One and two layer flex boards are ideally suited for dynamic motion. From a device that requires only a few hundred cycles over its lifetime like a hinged panel that opens only for maintenance or […]

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Working with ultra-thin substrates requires tools that are not commonly found in every PCB shop but once you have those tools at your disposal you can achieve results that are hard to match. Think of […]

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Layers: 4 Material: High Tg FR4 Trace Width: 0.0015 +/-0.0003” Surface Finish: Wirebondable Electrolytic Gold and Nickel Layers: 8 Materials: Thermount/Polyimide                    (Arlon 85N) Trace Width: 0.002 +/- 0.0003” Stacked Microvias: L1 to L2 to L3; […]

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High density packaging for the most complex die Specifications Layers: 4 Trace/Space: 3/2 (75/50 µm)                          Board Features:Electrolytic Ni/Au                          Bonded Heat Spreader                          Edge Plating                          Blind Microvias Material: High Tg FR4

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Specifications Layers: 12 Trace/Space: 6/6 (150/150 µm) Finish: Immersion Gold Material: Polyimide Rigid                  DuPont AP Flex

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Specifications Layers: 22 ‘Looseleaf’ Design Material: Polyimide Rigid                  DuPont AP Flex Certifications: IPC-6013 Class III Surface Finish: HAL

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Specifications Layers: 10 with 6 layers flex Finish: 2-Ounce Copper              Military Specification Design: Compunetics Drafting Department

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Specifications Layers: 8 ‘Looseleaf’ Design Board Features: 3 Double-Sided Flex Cores with Coverlay                               2-Ounce Copper on Flex                               Military Specification

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Specifications Layers: 14 rigid; 3 flex Material: High Speed FR4 (Isola 408)                  Dupont AP Flex material Trace Width: 0.002 +/- 0.0003”                         Controlled Impedance (64 ohms +/- 10%)                         Buried resistors (400 each of Ohmega Ply                         60 […]

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Military Layers: 8 Trace/Space: .0035″ / .0035″ Finish: HASL              Differential Controlled Impedance

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High-Energy Particle Detector Layers: 2 Trace/Space: 2/2 (50/50 µm) Materials: 2 mil thick DuPont AP Flex Finish: Immersion Au over Ni              Selective Plating Soldermask: Flexible LPI

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Compunetics is the only manufacturer to make flex with 4 steps of selective plating. This process creates bumplets that enable mechanical connection with an absolute minimum of force. Specifications Layers: 3 Trace/Space: 4 Steps Of […]

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3M’s C-Ply material’s high capacitive density enables it to perform the power supply decoupling function and eliminate discrete capacitors. This capability makes it especially beneficial for high-end equipment in the telecommunications, computer, test and measurement, […]

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Ohmega-Ply®, manufactured by Ohmega Technologies, Inc. and TCR®, manufactured by Ticer Technologies, LLC, are thin film resistor-conductor materials. Using standard subtractive printed circuit technology, integral resistors are formed on circuit layers. These resistors can be […]

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Specifications Layers: 4 Trace/Space: 1.5/1.5 (35/35 µm) Finish: Electrolytic Ni/Au Thickness: 31 ±

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Specifications Layers: 14 Trace/Space: 2/2 (50/50 µm) Finish: Electrolytic Ni/Au Thickness: Electrolytic Gold                      Blind Vias                      Cavity Design                      2 Buried Resistor Layers

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Designed for high speed networking (10 Gig Ethernet Card) Specifications: IPC-6012 Class III Layers: 8 Trace/Space: Rogers 4003/FR4 Mix Board Features: Blind Vias 1-4 for Stub Length Control                               Via-In-Pad using Conductive Epoxy                               2 Level “Cavity” […]

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Designed for high speed military radar Specifications Layers: 4 Material: Rogers 6002, 4350, 4403 Drilling: Blind 1-to-2; 4-to-3; 1-to-3; Buried 2-to-3 Cavity: 4-to-3 Trace Width: 10 mils Tolerance: +/- 0.0003” Surface Finish: Electrolytic Nickel and […]

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Designed for wireless communications Specifications Layers: 2 Material: Rogers 3003 Trace Width: 10 Tolerance: +/- 0.0003” Precision laser routed slots Finish: Electrolytic Nickel and Gold

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